Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate
The reactive spreading processes of Sn–17Bi–0.5Cu melt alloy on Cu substrate were studied by sessile drop method in the temperature range of 523–673 K. Dynamic contact angles between the solder and Cu substrate at different times were recorded with high-resolution CCD digital video. The smallest con...
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| Veröffentlicht in: | Rare metals 2013-12, Vol.32 (6), p.537-543 |
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| creator | Xu, Bing-Sheng Zang, Li-Kun Yuan, Zhang-Fu Wu, Yan Zhou, Zhou |
| description | The reactive spreading processes of Sn–17Bi–0.5Cu melt alloy on Cu substrate were studied by sessile drop method in the temperature range of 523–673 K. Dynamic contact angles between the solder and Cu substrate at different times were recorded with high-resolution CCD digital video. The smallest contact angle was observed at 623 and 673 K. Ultimate spreading radius does not increase monotonously with the temperature increasing. These can be attributed to the strong dissolution of Cu substrate into the liquid solder, which hinders the solder from spreading. Triple line area configuration of the Sn–17Bi–0.5Cu/Cu system was discussed by the description of the equilibrium state. The calculated results based on experiments of the tension balances along each of the three interfaces show good agreement with theoretical analysis. Intermetallic compounds at the Sn–17Bi–0.5Cu/Cu interface are identified as Cu
6
Sn
5
adjacent to the solder and Cu
3
Sn adjacent to the Cu substrate, respectively. These results are of practical interest for composite lead-free solders’ preparations and joining of Sn–17Bi–0.5Cu to Cu substrate. |
| doi_str_mv | 10.1007/s12598-013-0167-1 |
| format | Article |
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6
Sn
5
adjacent to the solder and Cu
3
Sn adjacent to the Cu substrate, respectively. These results are of practical interest for composite lead-free solders’ preparations and joining of Sn–17Bi–0.5Cu to Cu substrate.</description><identifier>ISSN: 1001-0521</identifier><identifier>EISSN: 1867-7185</identifier><identifier>DOI: 10.1007/s12598-013-0167-1</identifier><language>eng</language><publisher>Berlin/Heidelberg: Springer Berlin Heidelberg</publisher><subject>Biomaterials ; Chemistry and Materials Science ; COMPOSITES ; Energy ; Materials Engineering ; Materials Science ; Metallic Materials ; Nanoscale Science and Technology ; Physical Chemistry</subject><ispartof>Rare metals, 2013-12, Vol.32 (6), p.537-543</ispartof><rights>The Nonferrous Metals Society of China and Springer-Verlag Berlin Heidelberg 2013</rights><rights>Copyright © Wanfang Data Co. Ltd. All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c381t-ef5acbdcb1c8406fba33239b3da53b0e97332b440087db5ffd36aaca2e8d29dc3</citedby><cites>FETCH-LOGICAL-c381t-ef5acbdcb1c8406fba33239b3da53b0e97332b440087db5ffd36aaca2e8d29dc3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttp://www.wanfangdata.com.cn/images/PeriodicalImages/xyjs-e/xyjs-e.jpg</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s12598-013-0167-1$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s12598-013-0167-1$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,41464,42533,51294</link.rule.ids></links><search><creatorcontrib>Xu, Bing-Sheng</creatorcontrib><creatorcontrib>Zang, Li-Kun</creatorcontrib><creatorcontrib>Yuan, Zhang-Fu</creatorcontrib><creatorcontrib>Wu, Yan</creatorcontrib><creatorcontrib>Zhou, Zhou</creatorcontrib><title>Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate</title><title>Rare metals</title><addtitle>Rare Met</addtitle><description>The reactive spreading processes of Sn–17Bi–0.5Cu melt alloy on Cu substrate were studied by sessile drop method in the temperature range of 523–673 K. Dynamic contact angles between the solder and Cu substrate at different times were recorded with high-resolution CCD digital video. The smallest contact angle was observed at 623 and 673 K. Ultimate spreading radius does not increase monotonously with the temperature increasing. These can be attributed to the strong dissolution of Cu substrate into the liquid solder, which hinders the solder from spreading. Triple line area configuration of the Sn–17Bi–0.5Cu/Cu system was discussed by the description of the equilibrium state. The calculated results based on experiments of the tension balances along each of the three interfaces show good agreement with theoretical analysis. Intermetallic compounds at the Sn–17Bi–0.5Cu/Cu interface are identified as Cu
6
Sn
5
adjacent to the solder and Cu
3
Sn adjacent to the Cu substrate, respectively. These results are of practical interest for composite lead-free solders’ preparations and joining of Sn–17Bi–0.5Cu to Cu substrate.</description><subject>Biomaterials</subject><subject>Chemistry and Materials Science</subject><subject>COMPOSITES</subject><subject>Energy</subject><subject>Materials Engineering</subject><subject>Materials Science</subject><subject>Metallic Materials</subject><subject>Nanoscale Science and Technology</subject><subject>Physical Chemistry</subject><issn>1001-0521</issn><issn>1867-7185</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><sourceid>BENPR</sourceid><recordid>eNp1kc-O1DAMxisEEsvCA3CLxAEuXeymbdojzPJPWokDcI7cNB0y6iQlTlnmxjvwhjwJGRUhhMQhsi39_NnxVxSPEa4QQD1nrJq-KwFlfq0q8U5xgV1OFHbN3ZwDYAlNhfeLB8wHgLpuW7golmvHHOY1ua9W3NqUnN-LJQZjmQX5UTifbJzIOJqF-UyRTK4dJ2dEmMQxzMl68cH__P4D1UuXA1w1u1XQPIeTCF6YsCw2Cl4HTpGSfVjcm2hm--h3vCw-vX71cfe2vHn_5t3uxU1pZIeptFNDZhjNgKaroZ0GkrKS_SBHauQAtle5HuoaoFPj0EzTKFsiQ5Xtxqofjbwsnm66t-Qn8nt9CGv0eaL-djqwtlU-FbT5Kpl8tpH5219Wy0kfHRs7z-RtWFlj3dcS-xZkRp_8g_5RxVohNK1SKlO4USYG5mgnvUR3pHjSCPrslt7c0nm4Prulz0tUWw9n1u9t_Ev5v02_APKDmiY</recordid><startdate>20131201</startdate><enddate>20131201</enddate><creator>Xu, Bing-Sheng</creator><creator>Zang, Li-Kun</creator><creator>Yuan, Zhang-Fu</creator><creator>Wu, Yan</creator><creator>Zhou, Zhou</creator><general>Springer Berlin Heidelberg</general><general>Springer Nature B.V</general><general>Beijing Key Laboratory for Solid Waste Utilization and Management, Department of Energy and Resources Engineering,College of Engineering, Peking University, Beijing 100871,China%Department of Chemistry, School of Chemistry and Biology Engineering, University of Science and Technology Beijing,Beijing 100083, China</general><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>PDBOC</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>H8G</scope><scope>2B.</scope><scope>4A8</scope><scope>92I</scope><scope>93N</scope><scope>PSX</scope><scope>TCJ</scope></search><sort><creationdate>20131201</creationdate><title>Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate</title><author>Xu, Bing-Sheng ; Zang, Li-Kun ; Yuan, Zhang-Fu ; Wu, Yan ; Zhou, Zhou</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c381t-ef5acbdcb1c8406fba33239b3da53b0e97332b440087db5ffd36aaca2e8d29dc3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Biomaterials</topic><topic>Chemistry and Materials Science</topic><topic>COMPOSITES</topic><topic>Energy</topic><topic>Materials Engineering</topic><topic>Materials Science</topic><topic>Metallic Materials</topic><topic>Nanoscale Science and Technology</topic><topic>Physical Chemistry</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Xu, Bing-Sheng</creatorcontrib><creatorcontrib>Zang, Li-Kun</creatorcontrib><creatorcontrib>Yuan, Zhang-Fu</creatorcontrib><creatorcontrib>Wu, Yan</creatorcontrib><creatorcontrib>Zhou, Zhou</creatorcontrib><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>Materials Science Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central China</collection><collection>Copper Technical Reference Library</collection><collection>Wanfang Data Journals - Hong Kong</collection><collection>WANFANG Data Centre</collection><collection>Wanfang Data Journals</collection><collection>万方数据期刊 - 香港版</collection><collection>China Online Journals (COJ)</collection><collection>China Online Journals (COJ)</collection><jtitle>Rare metals</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Xu, Bing-Sheng</au><au>Zang, Li-Kun</au><au>Yuan, Zhang-Fu</au><au>Wu, Yan</au><au>Zhou, Zhou</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate</atitle><jtitle>Rare metals</jtitle><stitle>Rare Met</stitle><date>2013-12-01</date><risdate>2013</risdate><volume>32</volume><issue>6</issue><spage>537</spage><epage>543</epage><pages>537-543</pages><issn>1001-0521</issn><eissn>1867-7185</eissn><abstract>The reactive spreading processes of Sn–17Bi–0.5Cu melt alloy on Cu substrate were studied by sessile drop method in the temperature range of 523–673 K. Dynamic contact angles between the solder and Cu substrate at different times were recorded with high-resolution CCD digital video. The smallest contact angle was observed at 623 and 673 K. Ultimate spreading radius does not increase monotonously with the temperature increasing. These can be attributed to the strong dissolution of Cu substrate into the liquid solder, which hinders the solder from spreading. Triple line area configuration of the Sn–17Bi–0.5Cu/Cu system was discussed by the description of the equilibrium state. The calculated results based on experiments of the tension balances along each of the three interfaces show good agreement with theoretical analysis. Intermetallic compounds at the Sn–17Bi–0.5Cu/Cu interface are identified as Cu
6
Sn
5
adjacent to the solder and Cu
3
Sn adjacent to the Cu substrate, respectively. These results are of practical interest for composite lead-free solders’ preparations and joining of Sn–17Bi–0.5Cu to Cu substrate.</abstract><cop>Berlin/Heidelberg</cop><pub>Springer Berlin Heidelberg</pub><doi>10.1007/s12598-013-0167-1</doi><tpages>7</tpages></addata></record> |
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| subjects | Biomaterials Chemistry and Materials Science COMPOSITES Energy Materials Engineering Materials Science Metallic Materials Nanoscale Science and Technology Physical Chemistry |
| title | Dissolutive wetting process and interfacial characteristic of molten Sn–17Bi–0.5Cu alloy on copper substrate |
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