Copper-Ti3SiC2 composite powder prepared by electroless plating under ultrasonic environment
In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 mum in diameter on an average. The Cu plating was carried out at middle temperature (62-65 deg C) with the application of ultrasonic agitat...
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| Veröffentlicht in: | Rare metals 2007-08, Vol.26 (4), p.359-364 |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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