Electrochemical study and electrodeposition of copper(I) in ionic liquid-reline

The authors made the electrochemical studies on the electrode processes during copper electrodeposition with ionic liquids-reline as an electrolytic medium. Reline is a commercial name for a eutectic mixture of choline chloride and urea(1:2, molar ratio). This new proposed method of copper depositio...

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Veröffentlicht in:Chemical research in Chinese universities 2013-10, Vol.29 (5), p.991-997
Hauptverfasser: Popescu, Ana-Maria, Cojocaru, Anca, Donath, Cristina, Constantin, Virgil
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container_title Chemical research in Chinese universities
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creator Popescu, Ana-Maria
Cojocaru, Anca
Donath, Cristina
Constantin, Virgil
description The authors made the electrochemical studies on the electrode processes during copper electrodeposition with ionic liquids-reline as an electrolytic medium. Reline is a commercial name for a eutectic mixture of choline chloride and urea(1:2, molar ratio). This new proposed method of copper deposition is an ecological one because the ionic liquids are recyclable, non-volatile and non-toxic. Cyclic voltammetry investigations were conducted at 343 and 353 K in choline chloride-urea(Reline) deep eutectic solvent with single salt CuCl(generally in 0.05–0.38 mol/L concentration range). Electrochemical impedance spectroscopy investigations were conducted in choline chlorideurea ionic liquid with CuCl(0.05 mol/L). We investigated both cathodic and anodic processes of Cu + ions at different sweep rates in this new electrolytic system based on choline chloride. We have proposed by this an alternative to the classical copper electrodeposition. Coefficient of diffusion, D 0 , for the system Reline-CuCl is presented and the value of D 0 is 1.22×10 −8 cm 2 /s.
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fullrecord <record><control><sourceid>wanfang_jour_cross</sourceid><recordid>TN_cdi_wanfang_journals_gdxxhxyj201305032</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><wanfj_id>gdxxhxyj201305032</wanfj_id><sourcerecordid>gdxxhxyj201305032</sourcerecordid><originalsourceid>FETCH-LOGICAL-c322t-2d59027187d987b4ef560ac44c41a67653440fec9d04ec0a5cb6cac5d671b11c3</originalsourceid><addsrcrecordid>eNp1kE1LAzEQhoMoWKs_wFuO9hCdfO12j1LqBxR60XNIk2ybss2uyRa7_96UFTx5mYGZ95mBB6F7Co8UoHxKAphgBCgn_FyGCzRhjALhtKSXaJJDklQg4BrdpLQH4FVRiAlaLxtn-tianTt4oxuc-qMdsA4Wu3FjXdcm3_s24LbGpu06Fx_eZ9gHnGfe4MZ_Hb0l0TU-uFt0VesmubvfPkWfL8uPxRtZrV_fF88rYjhjPWFWVsBKOi9tNS83wtWyAG2EMILqoiwkFwJqZyoLwhnQ0mwKo420RUk3lBo-RbPx7rcOtQ5btW-PMeSPamtPp91p2LOsASRwlrN0zJrYphRdrbroDzoOioI621OjPZUJdbanhsywkUk5G7Yu_j34H_oBrcpzGw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Electrochemical study and electrodeposition of copper(I) in ionic liquid-reline</title><source>Springer Nature - Complete Springer Journals</source><creator>Popescu, Ana-Maria ; Cojocaru, Anca ; Donath, Cristina ; Constantin, Virgil</creator><creatorcontrib>Popescu, Ana-Maria ; Cojocaru, Anca ; Donath, Cristina ; Constantin, Virgil</creatorcontrib><description>The authors made the electrochemical studies on the electrode processes during copper electrodeposition with ionic liquids-reline as an electrolytic medium. Reline is a commercial name for a eutectic mixture of choline chloride and urea(1:2, molar ratio). This new proposed method of copper deposition is an ecological one because the ionic liquids are recyclable, non-volatile and non-toxic. Cyclic voltammetry investigations were conducted at 343 and 353 K in choline chloride-urea(Reline) deep eutectic solvent with single salt CuCl(generally in 0.05–0.38 mol/L concentration range). Electrochemical impedance spectroscopy investigations were conducted in choline chlorideurea ionic liquid with CuCl(0.05 mol/L). We investigated both cathodic and anodic processes of Cu + ions at different sweep rates in this new electrolytic system based on choline chloride. We have proposed by this an alternative to the classical copper electrodeposition. Coefficient of diffusion, D 0 , for the system Reline-CuCl is presented and the value of D 0 is 1.22×10 −8 cm 2 /s.</description><identifier>ISSN: 1005-9040</identifier><identifier>EISSN: 2210-3171</identifier><identifier>DOI: 10.1007/s40242-013-3013-y</identifier><language>eng</language><publisher>Berlin/Heidelberg: Springer Berlin Heidelberg</publisher><subject>Analytical Chemistry ; Chemistry ; Chemistry and Materials Science ; Chemistry/Food Science ; Inorganic Chemistry ; Organic Chemistry ; Physical Chemistry</subject><ispartof>Chemical research in Chinese universities, 2013-10, Vol.29 (5), p.991-997</ispartof><rights>Jilin University, The Editorial Department of Chemical Research in Chinese Universities and Springer-Verlag GmbH 2013</rights><rights>Copyright © Wanfang Data Co. Ltd. All Rights Reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c322t-2d59027187d987b4ef560ac44c41a67653440fec9d04ec0a5cb6cac5d671b11c3</citedby><cites>FETCH-LOGICAL-c322t-2d59027187d987b4ef560ac44c41a67653440fec9d04ec0a5cb6cac5d671b11c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Uhttp://www.wanfangdata.com.cn/images/PeriodicalImages/gdxxhxyj/gdxxhxyj.jpg</thumbnail><linktopdf>$$Uhttps://link.springer.com/content/pdf/10.1007/s40242-013-3013-y$$EPDF$$P50$$Gspringer$$H</linktopdf><linktohtml>$$Uhttps://link.springer.com/10.1007/s40242-013-3013-y$$EHTML$$P50$$Gspringer$$H</linktohtml><link.rule.ids>314,780,784,27924,27925,41488,42557,51319</link.rule.ids></links><search><creatorcontrib>Popescu, Ana-Maria</creatorcontrib><creatorcontrib>Cojocaru, Anca</creatorcontrib><creatorcontrib>Donath, Cristina</creatorcontrib><creatorcontrib>Constantin, Virgil</creatorcontrib><title>Electrochemical study and electrodeposition of copper(I) in ionic liquid-reline</title><title>Chemical research in Chinese universities</title><addtitle>Chem. Res. Chin. Univ</addtitle><description>The authors made the electrochemical studies on the electrode processes during copper electrodeposition with ionic liquids-reline as an electrolytic medium. Reline is a commercial name for a eutectic mixture of choline chloride and urea(1:2, molar ratio). This new proposed method of copper deposition is an ecological one because the ionic liquids are recyclable, non-volatile and non-toxic. Cyclic voltammetry investigations were conducted at 343 and 353 K in choline chloride-urea(Reline) deep eutectic solvent with single salt CuCl(generally in 0.05–0.38 mol/L concentration range). Electrochemical impedance spectroscopy investigations were conducted in choline chlorideurea ionic liquid with CuCl(0.05 mol/L). We investigated both cathodic and anodic processes of Cu + ions at different sweep rates in this new electrolytic system based on choline chloride. We have proposed by this an alternative to the classical copper electrodeposition. Coefficient of diffusion, D 0 , for the system Reline-CuCl is presented and the value of D 0 is 1.22×10 −8 cm 2 /s.</description><subject>Analytical Chemistry</subject><subject>Chemistry</subject><subject>Chemistry and Materials Science</subject><subject>Chemistry/Food Science</subject><subject>Inorganic Chemistry</subject><subject>Organic Chemistry</subject><subject>Physical Chemistry</subject><issn>1005-9040</issn><issn>2210-3171</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><recordid>eNp1kE1LAzEQhoMoWKs_wFuO9hCdfO12j1LqBxR60XNIk2ybss2uyRa7_96UFTx5mYGZ95mBB6F7Co8UoHxKAphgBCgn_FyGCzRhjALhtKSXaJJDklQg4BrdpLQH4FVRiAlaLxtn-tianTt4oxuc-qMdsA4Wu3FjXdcm3_s24LbGpu06Fx_eZ9gHnGfe4MZ_Hb0l0TU-uFt0VesmubvfPkWfL8uPxRtZrV_fF88rYjhjPWFWVsBKOi9tNS83wtWyAG2EMILqoiwkFwJqZyoLwhnQ0mwKo420RUk3lBo-RbPx7rcOtQ5btW-PMeSPamtPp91p2LOsASRwlrN0zJrYphRdrbroDzoOioI621OjPZUJdbanhsywkUk5G7Yu_j34H_oBrcpzGw</recordid><startdate>20131001</startdate><enddate>20131001</enddate><creator>Popescu, Ana-Maria</creator><creator>Cojocaru, Anca</creator><creator>Donath, Cristina</creator><creator>Constantin, Virgil</creator><general>Springer Berlin Heidelberg</general><general>Laboratory of Molten Salts, "Ilie Murgulescu" Institute of Physical Chemistry of Romanian Academy,Bucharest 060021, Romania%Department of Applied Physical Chemistry and Electrochemistry, University Politehnica of Bucharest,Bucharest 010737.Romania</general><scope>AAYXX</scope><scope>CITATION</scope><scope>2B.</scope><scope>4A8</scope><scope>92I</scope><scope>93N</scope><scope>PSX</scope><scope>TCJ</scope></search><sort><creationdate>20131001</creationdate><title>Electrochemical study and electrodeposition of copper(I) in ionic liquid-reline</title><author>Popescu, Ana-Maria ; Cojocaru, Anca ; Donath, Cristina ; Constantin, Virgil</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c322t-2d59027187d987b4ef560ac44c41a67653440fec9d04ec0a5cb6cac5d671b11c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Analytical Chemistry</topic><topic>Chemistry</topic><topic>Chemistry and Materials Science</topic><topic>Chemistry/Food Science</topic><topic>Inorganic Chemistry</topic><topic>Organic Chemistry</topic><topic>Physical Chemistry</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Popescu, Ana-Maria</creatorcontrib><creatorcontrib>Cojocaru, Anca</creatorcontrib><creatorcontrib>Donath, Cristina</creatorcontrib><creatorcontrib>Constantin, Virgil</creatorcontrib><collection>CrossRef</collection><collection>Wanfang Data Journals - Hong Kong</collection><collection>WANFANG Data Centre</collection><collection>Wanfang Data Journals</collection><collection>万方数据期刊 - 香港版</collection><collection>China Online Journals (COJ)</collection><collection>China Online Journals (COJ)</collection><jtitle>Chemical research in Chinese universities</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Popescu, Ana-Maria</au><au>Cojocaru, Anca</au><au>Donath, Cristina</au><au>Constantin, Virgil</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Electrochemical study and electrodeposition of copper(I) in ionic liquid-reline</atitle><jtitle>Chemical research in Chinese universities</jtitle><stitle>Chem. Res. Chin. Univ</stitle><date>2013-10-01</date><risdate>2013</risdate><volume>29</volume><issue>5</issue><spage>991</spage><epage>997</epage><pages>991-997</pages><issn>1005-9040</issn><eissn>2210-3171</eissn><abstract>The authors made the electrochemical studies on the electrode processes during copper electrodeposition with ionic liquids-reline as an electrolytic medium. Reline is a commercial name for a eutectic mixture of choline chloride and urea(1:2, molar ratio). This new proposed method of copper deposition is an ecological one because the ionic liquids are recyclable, non-volatile and non-toxic. Cyclic voltammetry investigations were conducted at 343 and 353 K in choline chloride-urea(Reline) deep eutectic solvent with single salt CuCl(generally in 0.05–0.38 mol/L concentration range). Electrochemical impedance spectroscopy investigations were conducted in choline chlorideurea ionic liquid with CuCl(0.05 mol/L). We investigated both cathodic and anodic processes of Cu + ions at different sweep rates in this new electrolytic system based on choline chloride. We have proposed by this an alternative to the classical copper electrodeposition. Coefficient of diffusion, D 0 , for the system Reline-CuCl is presented and the value of D 0 is 1.22×10 −8 cm 2 /s.</abstract><cop>Berlin/Heidelberg</cop><pub>Springer Berlin Heidelberg</pub><doi>10.1007/s40242-013-3013-y</doi><tpages>7</tpages></addata></record>
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subjects Analytical Chemistry
Chemistry
Chemistry and Materials Science
Chemistry/Food Science
Inorganic Chemistry
Organic Chemistry
Physical Chemistry
title Electrochemical study and electrodeposition of copper(I) in ionic liquid-reline
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-25T09%3A11%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-wanfang_jour_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Electrochemical%20study%20and%20electrodeposition%20of%20copper(I)%20in%20ionic%20liquid-reline&rft.jtitle=Chemical%20research%20in%20Chinese%20universities&rft.au=Popescu,%20Ana-Maria&rft.date=2013-10-01&rft.volume=29&rft.issue=5&rft.spage=991&rft.epage=997&rft.pages=991-997&rft.issn=1005-9040&rft.eissn=2210-3171&rft_id=info:doi/10.1007/s40242-013-3013-y&rft_dat=%3Cwanfang_jour_cross%3Egdxxhxyj201305032%3C/wanfang_jour_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_wanfj_id=gdxxhxyj201305032&rfr_iscdi=true