Effect of Ag and Ni on the melting point and solderability of SnSbCu solder alloys
To improve the properties of Sn10Sb8Cu solder alloy, two new solders （SnSbCuAg and SnSbCuNi） were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compar...
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| Veröffentlicht in: | International journal of minerals, metallurgy and materials metallurgy and materials, 2009-12, Vol.16 (6), p.691-695 |
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| container_title | International journal of minerals, metallurgy and materials |
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| creator | Yan, Yan-fu Wang, Yan-sheng Feng, Li-fang Song, Ke-xing Wen, Jiu-ba |
| description | To improve the properties of Sn10Sb8Cu solder alloy, two new solders （SnSbCuAg and SnSbCuNi） were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni, Cu6Sn5 and （Cu, Ni）6Sn5 with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy, which makes the viscosity of the melting solder increase and the spreading property of the solder decline. |
| doi_str_mv | 10.1016/S1674-4799(10)60014-3 |
| format | Article |
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The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni, Cu6Sn5 and （Cu, Ni）6Sn5 with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy, which makes the viscosity of the melting solder increase and the spreading property of the solder decline.</description><identifier>ISSN: 1674-4799</identifier><identifier>EISSN: 1869-103X</identifier><identifier>DOI: 10.1016/S1674-4799(10)60014-3</identifier><language>eng</language><publisher>Elsevier Ltd</publisher><subject>Alloys ; Copper ; Intermetallic compounds ; Melting ; melting point ; Melting points ; Nickel ; Silver ; solder alloy ; solderability ; Solders ; Spreading ; 可焊性 ; 合金性能 ; 微观分析 ; 微量元素 ; 微量镍</subject><ispartof>International journal of minerals, metallurgy and materials, 2009-12, Vol.16 (6), p.691-695</ispartof><rights>2009 University of Science and Techonogy Beijing</rights><rights>Copyright © Wanfang Data Co. Ltd. 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The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni, Cu6Sn5 and （Cu, Ni）6Sn5 with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy, which makes the viscosity of the melting solder increase and the spreading property of the solder decline.</description><subject>Alloys</subject><subject>Copper</subject><subject>Intermetallic compounds</subject><subject>Melting</subject><subject>melting point</subject><subject>Melting points</subject><subject>Nickel</subject><subject>Silver</subject><subject>solder alloy</subject><subject>solderability</subject><subject>Solders</subject><subject>Spreading</subject><subject>可焊性</subject><subject>合金性能</subject><subject>微观分析</subject><subject>微量元素</subject><subject>微量镍</subject><issn>1674-4799</issn><issn>1869-103X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2009</creationdate><recordtype>article</recordtype><recordid>eNo1kE1vEzEQhleISpSWn4BkcSpCC-P1V_aEqqgFpAok0gM3yzs7Tp26drve0Pbf4yTl5NH48Tuep2nec_jMgesvK66NbKXp-zMOHzUAl6141Rzzhe5bDuLP61r_R940b0vZAGhjwBw3vy-8J5xZ9ux8zVwa2c_AcmLzDbE7inNIa3afQ5r3dyXHkSY3hBjm592bVVoNy-1Ln7kY83M5bY68i4XevZwnzfXlxfXye3v169uP5flViwLM3HLXgZRqRCUVEoLhg0JlSHdmWPCxriH4CNzhwnhEDYqk9CQcetUpRHHSfDrEPrrkXVrbTd5OqQ60w-Z2Mz49DZY6gB509VHpswN9P-WHLZXZ3oWCFKNLlLfF8k5XQ7JXuqJfDyjVz_8NNNmCgRLSGKaqyo45WA52p97u1dud111rr96KmvDhkIA3Oa0fqkM7OLz1IZIVnTK97IT4B6aJgfw</recordid><startdate>20091201</startdate><enddate>20091201</enddate><creator>Yan, Yan-fu</creator><creator>Wang, Yan-sheng</creator><creator>Feng, Li-fang</creator><creator>Song, Ke-xing</creator><creator>Wen, Jiu-ba</creator><general>Elsevier Ltd</general><general>Henan Key Laboratory of Advanced Non-ferrous Metals,Luoyang 471003, China%Architecture and Civil Engineering Institute,Henan University of Science and Technology,Luoyang 471003, China</general><scope>2RA</scope><scope>92L</scope><scope>CQIGP</scope><scope>W92</scope><scope>~WA</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>2B.</scope><scope>4A8</scope><scope>92I</scope><scope>93N</scope><scope>PSX</scope><scope>TCJ</scope></search><sort><creationdate>20091201</creationdate><title>Effect of Ag and Ni on the melting point and solderability of SnSbCu solder alloys</title><author>Yan, Yan-fu ; Wang, Yan-sheng ; Feng, Li-fang ; Song, Ke-xing ; Wen, Jiu-ba</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c307t-1a20445dc545cec071b5c57e627b81d60031d01ac87fcc605e44fe3acf525cc3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2009</creationdate><topic>Alloys</topic><topic>Copper</topic><topic>Intermetallic compounds</topic><topic>Melting</topic><topic>melting point</topic><topic>Melting points</topic><topic>Nickel</topic><topic>Silver</topic><topic>solder alloy</topic><topic>solderability</topic><topic>Solders</topic><topic>Spreading</topic><topic>可焊性</topic><topic>合金性能</topic><topic>微观分析</topic><topic>微量元素</topic><topic>微量镍</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Yan, Yan-fu</creatorcontrib><creatorcontrib>Wang, Yan-sheng</creatorcontrib><creatorcontrib>Feng, Li-fang</creatorcontrib><creatorcontrib>Song, Ke-xing</creatorcontrib><creatorcontrib>Wen, Jiu-ba</creatorcontrib><collection>中文科技期刊数据库</collection><collection>中文科技期刊数据库-CALIS站点</collection><collection>中文科技期刊数据库-7.0平台</collection><collection>中文科技期刊数据库-工程技术</collection><collection>中文科技期刊数据库- 镜像站点</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>Wanfang Data Journals - Hong Kong</collection><collection>WANFANG Data Centre</collection><collection>Wanfang Data Journals</collection><collection>万方数据期刊 - 香港版</collection><collection>China Online Journals (COJ)</collection><collection>China Online Journals (COJ)</collection><jtitle>International journal of minerals, metallurgy and materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yan, Yan-fu</au><au>Wang, Yan-sheng</au><au>Feng, Li-fang</au><au>Song, Ke-xing</au><au>Wen, Jiu-ba</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effect of Ag and Ni on the melting point and solderability of SnSbCu solder alloys</atitle><jtitle>International journal of minerals, metallurgy and materials</jtitle><addtitle>International Journal of Minerals,Metallurgy and Materials</addtitle><date>2009-12-01</date><risdate>2009</risdate><volume>16</volume><issue>6</issue><spage>691</spage><epage>695</epage><pages>691-695</pages><issn>1674-4799</issn><eissn>1869-103X</eissn><abstract>To improve the properties of Sn10Sb8Cu solder alloy, two new solders （SnSbCuAg and SnSbCuNi） were formed by adding small amounts of Ag or Ni into the solder alloy. The results show that the melting point of the SnSbCuAg solder alloy decreases by 14.1℃ and the spreading area increases by 16.5% compared to the matrix solder. The melting point of the SnSbCuNi solder alloy decreases by 5.4℃ and the spreading area is slightly less than that of the matrix solder. Microstructure analysis shows that adding trace Ag makes the melting point decline due to the dispersed distribution of SnAg phase with low melting point. Adding trace Ni, Cu6Sn5 and （Cu, Ni）6Sn5 with polyhedron shape on the copper substrate can be easily seen in the SnSbCuNi solder alloy, which makes the viscosity of the melting solder increase and the spreading property of the solder decline.</abstract><pub>Elsevier Ltd</pub><doi>10.1016/S1674-4799(10)60014-3</doi><tpages>5</tpages></addata></record> |
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| identifier | ISSN: 1674-4799 |
| ispartof | International journal of minerals, metallurgy and materials, 2009-12, Vol.16 (6), p.691-695 |
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| source | Alma/SFX Local Collection |
| subjects | Alloys Copper Intermetallic compounds Melting melting point Melting points Nickel Silver solder alloy solderability Solders Spreading 可焊性 合金性能 微观分析 微量元素 微量镍 |
| title | Effect of Ag and Ni on the melting point and solderability of SnSbCu solder alloys |
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