Kinetics of electroless Ni-Cu-P deposits on silicon in a basic hypophosphite-type bath

Electroless Ni-Cu-P deposits were deposited on the Si substrate in a basic hypophosphite-type plating bath. The effects of pH value and the metal source composition, Ni and Cu, in the plating bath on the kinetics of the Ni-Cu-P deposition were studied. The electroless Ni-Cu-P deposits were character...

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Veröffentlicht in:	International journal of minerals, metallurgy and materials metallurgy and materials, 2009-04, Vol.16 (2), p.197-202
Hauptverfasser:	Liu, Wei-Long, Hsieh, Shu-Huei, Chen, Wen-Jauh
Format:	Artikel
Sprache:	eng
Schlagworte:	activation energy electroless deposition kinetics Ni-Cu-P silicon substrate
Online-Zugang:	Volltext
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