Thermal bonding sheet and thermal bonding sheet with dicing tape
Provided are a thermal bonding sheet capable of suppressing inhibition of sintering of sinterable metallic particles by an organic component, thereby imparting sufficient bonding reliability to a power semiconductor device, and a thermal bonding sheet with a dicing tape having the thermal bonding sh...
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| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
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