Cyclical deposition method and apparatus for filling a recess formed within a substrate surface

There is provided a method of filling one or more recesses by providing the substrate in a reaction chamber; introducing a first reactant, to form first active species, for a first pulse time to the substrate; introducing a second reactant for a second pulse time to the substrate; and introducing a...

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1. Verfasser: ASM IP Holding B.V
Format: Patent
Sprache:eng
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