Semiconductor packaging structure

Packaging structure is provided. A substrate is provided, and an adhesive layer is formed on the substrate. An improvement layer is formed on the adhesive layer. The improvement layer contains openings exposing surface portions of the adhesive layer at bottoms of the openings. A plurality of chips i...

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1. Verfasser:	TONGFU MICROELECTRONICS CO., LTD
Format:	Patent
Sprache:	eng
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creator	TONGFU MICROELECTRONICS CO., LTD
description	Packaging structure is provided. A substrate is provided, and an adhesive layer is formed on the substrate. An improvement layer is formed on the adhesive layer. The improvement layer contains openings exposing surface portions of the adhesive layer at bottoms of the openings. A plurality of chips is provided and includes functional surfaces. The plurality of chips is mounted on the substrate such that the functional surfaces are bonded to the adhesive layer at the bottoms of the openings.
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fullrecord	<record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_11791310</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>11791310</sourcerecordid><originalsourceid>FETCH-uspatents_grants_117913103</originalsourceid><addsrcrecordid>eNrjZFAMTs3NTM7PSylNLskvUihITM5OTM_MS1coLikCCpUWpfIwsKYl5hSn8kJpbgYFN9cQZw_d0uKCxJLUvJLi-PSiRBBlaGhuaWhsaGBMhBIAoNEnGQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor packaging structure</title><source>USPTO Issued Patents</source><creator>TONGFU MICROELECTRONICS CO., LTD</creator><creatorcontrib>TONGFU MICROELECTRONICS CO., LTD</creatorcontrib><description>Packaging structure is provided. A substrate is provided, and an adhesive layer is formed on the substrate. An improvement layer is formed on the adhesive layer. The improvement layer contains openings exposing surface portions of the adhesive layer at bottoms of the openings. A plurality of chips is provided and includes functional surfaces. The plurality of chips is mounted on the substrate such that the functional surfaces are bonded to the adhesive layer at the bottoms of the openings.</description><language>eng</language><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/11791310$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/11791310$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TONGFU MICROELECTRONICS CO., LTD</creatorcontrib><title>Semiconductor packaging structure</title><description>Packaging structure is provided. A substrate is provided, and an adhesive layer is formed on the substrate. An improvement layer is formed on the adhesive layer. The improvement layer contains openings exposing surface portions of the adhesive layer at bottoms of the openings. A plurality of chips is provided and includes functional surfaces. The plurality of chips is mounted on the substrate such that the functional surfaces are bonded to the adhesive layer at the bottoms of the openings.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZFAMTs3NTM7PSylNLskvUihITM5OTM_MS1coLikCCpUWpfIwsKYl5hSn8kJpbgYFN9cQZw_d0uKCxJLUvJLi-PSiRBBlaGhuaWhsaGBMhBIAoNEnGQ</recordid><startdate>20231017</startdate><enddate>20231017</enddate><creator>TONGFU MICROELECTRONICS CO., LTD</creator><scope>EFH</scope></search><sort><creationdate>20231017</creationdate><title>Semiconductor packaging structure</title></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_117913103</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><toplevel>online_resources</toplevel><creatorcontrib>TONGFU MICROELECTRONICS CO., LTD</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><aucorp>TONGFU MICROELECTRONICS CO., LTD</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor packaging structure</title><date>2023-10-17</date><risdate>2023</risdate><abstract>Packaging structure is provided. A substrate is provided, and an adhesive layer is formed on the substrate. An improvement layer is formed on the adhesive layer. The improvement layer contains openings exposing surface portions of the adhesive layer at bottoms of the openings. A plurality of chips is provided and includes functional surfaces. The plurality of chips is mounted on the substrate such that the functional surfaces are bonded to the adhesive layer at the bottoms of the openings.</abstract><oa>free_for_read</oa></addata></record>
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source	USPTO Issued Patents
title	Semiconductor packaging structure
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T10%3A16%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.aucorp=TONGFU%20MICROELECTRONICS%20CO.,%20LTD&rft.date=2023-10-17&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E11791310%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true