Wafer heating and temperature control by backside fluid injection

In one of the many embodiments, an apparatus for processing a substrate is provided which includes a substrate processing chamber where the substrate is positioned within the substrate processing chamber so the substrate at least partially separates the substrate processing chamber into a first cham...

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Hauptverfasser:	Mooring, Ben, Parks, John, Hymes, Diane J
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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