Compositions and methods for removing organic substances

Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic...

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Hauptverfasser: Quillen, Michael Wayne, O'Dell, Dale Edward, Lee, Zachary Philip, Moore, John Cleaon, McEntire, Edward Enns
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Sprache:eng
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creator Quillen, Michael Wayne
O'Dell, Dale Edward
Lee, Zachary Philip
Moore, John Cleaon
McEntire, Edward Enns
description Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
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title Compositions and methods for removing organic substances
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