Compositions and methods for removing organic substances
Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic...
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creator | Quillen, Michael Wayne O'Dell, Dale Edward Lee, Zachary Philip Moore, John Cleaon McEntire, Edward Enns |
description | Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices. |
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fullrecord | <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_08309502</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>08309502</sourcerecordid><originalsourceid>FETCH-uspatents_grants_083095023</originalsourceid><addsrcrecordid>eNrjZLBwzs8tyC_OLMnMzytWSMxLUchNLcnITylWSMsvUihKzc0vy8xLV8gvSk_My0xWKC5NKi5JzEtOLeZhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwMLYwNLUwMiYCCUAGX4vvQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Compositions and methods for removing organic substances</title><source>USPTO Issued Patents</source><creator>Quillen, Michael Wayne ; O'Dell, Dale Edward ; Lee, Zachary Philip ; Moore, John Cleaon ; McEntire, Edward Enns</creator><creatorcontrib>Quillen, Michael Wayne ; O'Dell, Dale Edward ; Lee, Zachary Philip ; Moore, John Cleaon ; McEntire, Edward Enns ; Eastman Chemical Company</creatorcontrib><description>Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.</description><language>eng</language><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8309502$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8309502$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Quillen, Michael Wayne</creatorcontrib><creatorcontrib>O'Dell, Dale Edward</creatorcontrib><creatorcontrib>Lee, Zachary Philip</creatorcontrib><creatorcontrib>Moore, John Cleaon</creatorcontrib><creatorcontrib>McEntire, Edward Enns</creatorcontrib><creatorcontrib>Eastman Chemical Company</creatorcontrib><title>Compositions and methods for removing organic substances</title><description>Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZLBwzs8tyC_OLMnMzytWSMxLUchNLcnITylWSMsvUihKzc0vy8xLV8gvSk_My0xWKC5NKi5JzEtOLeZhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwMLYwNLUwMiYCCUAGX4vvQ</recordid><startdate>20121113</startdate><enddate>20121113</enddate><creator>Quillen, Michael Wayne</creator><creator>O'Dell, Dale Edward</creator><creator>Lee, Zachary Philip</creator><creator>Moore, John Cleaon</creator><creator>McEntire, Edward Enns</creator><scope>EFH</scope></search><sort><creationdate>20121113</creationdate><title>Compositions and methods for removing organic substances</title><author>Quillen, Michael Wayne ; O'Dell, Dale Edward ; Lee, Zachary Philip ; Moore, John Cleaon ; McEntire, Edward Enns</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_083095023</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Quillen, Michael Wayne</creatorcontrib><creatorcontrib>O'Dell, Dale Edward</creatorcontrib><creatorcontrib>Lee, Zachary Philip</creatorcontrib><creatorcontrib>Moore, John Cleaon</creatorcontrib><creatorcontrib>McEntire, Edward Enns</creatorcontrib><creatorcontrib>Eastman Chemical Company</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Quillen, Michael Wayne</au><au>O'Dell, Dale Edward</au><au>Lee, Zachary Philip</au><au>Moore, John Cleaon</au><au>McEntire, Edward Enns</au><aucorp>Eastman Chemical Company</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Compositions and methods for removing organic substances</title><date>2012-11-13</date><risdate>2012</risdate><abstract>Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.</abstract><oa>free_for_read</oa></addata></record> |
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title | Compositions and methods for removing organic substances |
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