Method and apparatus for electroplating

Method and apparatus for electroplating

An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second catho...

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Hauptverfasser: Reid, Jonathan, Buckalew, Bryan, He, Zhian, Park, Seyang, Varadarajan, Seshasayee, Pennington, Bryan, Ponnuswamy, Thomas, Breling, Patrick, Ibarreta, Glenn, Mayer, Steven
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creator Reid, Jonathan
Buckalew, Bryan
He, Zhian
Park, Seyang
Varadarajan, Seshasayee
Pennington, Bryan
Ponnuswamy, Thomas
Breling, Patrick
Ibarreta, Glenn
Mayer, Steven
description An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second cathode configured to divert a portion of current from the wafer surface. The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.
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The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. 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The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.</abstract><oa>free_for_read</oa></addata></record>
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title Method and apparatus for electroplating
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