Printed circuit board and manufacturing method therefor

Printed circuit board and manufacturing method therefor

A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Daikuhara, Osamu, Kusagaya, Toshihiro, Yamakami, Toru, Kondou, Takahiro
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Daikuhara, Osamu
Kusagaya, Toshihiro
Yamakami, Toru
Kondou, Takahiro
description A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in connection with the interconnections, when the connecting terminals are formed by the electrolytic plating. The interconnections are electrically isolated from the connecting terminal-forming wirings by process openings formed in the substrate.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_08288661</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>08288661</sourcerecordid><originalsourceid>FETCH-uspatents_grants_082886613</originalsourceid><addsrcrecordid>eNrjZDAPKMrMK0lNUUjOLEouzSxRSMpPLEpRSMxLUchNzCtNS0wuKQWqSFfITS3JyE9RKMlILUpNyy_iYWBNS8wpTuWF0twMCm6uIc4euqXFBYklqXklxfHpRYkgysDCyMLCzMzQmAglAMPfLzI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Printed circuit board and manufacturing method therefor</title><source>USPTO Issued Patents</source><creator>Daikuhara, Osamu ; Kusagaya, Toshihiro ; Yamakami, Toru ; Kondou, Takahiro</creator><creatorcontrib>Daikuhara, Osamu ; Kusagaya, Toshihiro ; Yamakami, Toru ; Kondou, Takahiro ; Fujitsu Component Limited</creatorcontrib><description>A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in connection with the interconnections, when the connecting terminals are formed by the electrolytic plating. The interconnections are electrically isolated from the connecting terminal-forming wirings by process openings formed in the substrate.</description><language>eng</language><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8288661$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8288661$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Daikuhara, Osamu</creatorcontrib><creatorcontrib>Kusagaya, Toshihiro</creatorcontrib><creatorcontrib>Yamakami, Toru</creatorcontrib><creatorcontrib>Kondou, Takahiro</creatorcontrib><creatorcontrib>Fujitsu Component Limited</creatorcontrib><title>Printed circuit board and manufacturing method therefor</title><description>A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in connection with the interconnections, when the connecting terminals are formed by the electrolytic plating. The interconnections are electrically isolated from the connecting terminal-forming wirings by process openings formed in the substrate.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZDAPKMrMK0lNUUjOLEouzSxRSMpPLEpRSMxLUchNzCtNS0wuKQWqSFfITS3JyE9RKMlILUpNyy_iYWBNS8wpTuWF0twMCm6uIc4euqXFBYklqXklxfHpRYkgysDCyMLCzMzQmAglAMPfLzI</recordid><startdate>20121016</startdate><enddate>20121016</enddate><creator>Daikuhara, Osamu</creator><creator>Kusagaya, Toshihiro</creator><creator>Yamakami, Toru</creator><creator>Kondou, Takahiro</creator><scope>EFH</scope></search><sort><creationdate>20121016</creationdate><title>Printed circuit board and manufacturing method therefor</title><author>Daikuhara, Osamu ; Kusagaya, Toshihiro ; Yamakami, Toru ; Kondou, Takahiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_082886613</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Daikuhara, Osamu</creatorcontrib><creatorcontrib>Kusagaya, Toshihiro</creatorcontrib><creatorcontrib>Yamakami, Toru</creatorcontrib><creatorcontrib>Kondou, Takahiro</creatorcontrib><creatorcontrib>Fujitsu Component Limited</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Daikuhara, Osamu</au><au>Kusagaya, Toshihiro</au><au>Yamakami, Toru</au><au>Kondou, Takahiro</au><aucorp>Fujitsu Component Limited</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Printed circuit board and manufacturing method therefor</title><date>2012-10-16</date><risdate>2012</risdate><abstract>A printed circuit board of a card edge connector type includes interconnections formed on a surface of a substrate to be electrically coupled to respective connecting terminals formed by electrolytic plating on an edge of the substrate, and connecting terminal-forming wirings being respectively in connection with the interconnections, when the connecting terminals are formed by the electrolytic plating. The interconnections are electrically isolated from the connecting terminal-forming wirings by process openings formed in the substrate.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_08288661
source USPTO Issued Patents
title Printed circuit board and manufacturing method therefor
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-13T04%3A16%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Daikuhara,%20Osamu&rft.aucorp=Fujitsu%20Component%20Limited&rft.date=2012-10-16&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E08288661%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true