Heat dissipation device

A heat dissipation device includes a base and a fin group placed on the base and a plurality of heat pipes thermally connecting the base and the fin group together. The base includes a substrate and a conducting plate attached to a bottom of the substrate. The heat pipes include evaporating sections...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Qin, Ji-Yun, Zhou, Zhi-Yong
Format: Patent
Sprache:eng
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