Flip chip assembly process for ultra thin substrate and package on package assembly

Flip chip assembly process for ultra thin substrate and package on package assembly

In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the s...

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Hauptverfasser: Mong, Weng Khoon, Rudge, A. Vethanayagam, Lim, Bok Sim, Loke, Mun Leong, Ong, Kang Eu, Lim, Sih Fei, Ong, Tean Wee
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Sprache:eng
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creator Mong, Weng Khoon
Rudge, A. Vethanayagam
Lim, Bok Sim
Loke, Mun Leong
Ong, Kang Eu
Lim, Sih Fei
Ong, Tean Wee
description In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, attaching solder balls to a backside of the coreless substrate strip, and forming a backside stiffening mold amongst the solder balls. Other embodiments are also disclosed and claimed.
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title Flip chip assembly process for ultra thin substrate and package on package assembly
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