Adhesive encapsulating composition and electronic devices made therewith

Adhesive encapsulating compositions for use in electronic devices such as organic electroluminescent devices, touch screens, photovoltaic devices, and thin film transistors are disclosed herein. The adhesive encapsulating compositions include pressure sensitive adhesives comprising one or more polyi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Fujita, Jun, Kobori, Nami, Bharti, Vivek, McCormick, Fred B, Mollenhauer, Serena L
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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