Electroconductive bonding material and electronic apparatus

An electroconductive bonding material contains a thermosetting resin, a low-melting-point metal powder which is melted at a temperature equal to or lower than the thermosetting temperature of the thermosetting resin, a high-melting-point metal powder which is not melted at a temperature equal to or...

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Bibliographische Detailangaben

Hauptverfasser:	Nomura, Akihiro, Takaoka, Hidekiyo, Nakano, Kosuke
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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