Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating compo...

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Bibliographische Detailangaben

Hauptverfasser:	Choi, Kyoung-sei, Kim, Byung-seo, Joo, Young-jae, Chung, Ye-chung, Cho, Kyong-soon, Lee, Sang-heui, Lee, Si-hoon, Kang, Sa-yoon, Son, Dae-woo, Jo, Sang-gui, Ha, Jeong-kyu, Cho, Young-sang
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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