Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating compo...
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| creator | Choi, Kyoung-sei Kim, Byung-seo Joo, Young-jae Chung, Ye-chung Cho, Kyong-soon Lee, Sang-heui Lee, Si-hoon Kang, Sa-yoon Son, Dae-woo Jo, Sang-gui Ha, Jeong-kyu Cho, Young-sang |
| description | Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component. |
| format | Patent |
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The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.</abstract><oa>free_for_read</oa></addata></record> |
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| title | Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same |
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