Semiconductor device and manufacture method thereof

A joint board is arranged between an upper package and a lower package. The arrangement of the joint board makes it possible to reduce the size of solder balls and to arrange them with narrower pitch. The joint board has slightly greater dimensions those of the upper package and the lower package. T...

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1. Verfasser:	Shibamoto, Masanori
Format:	Patent
Sprache:	eng
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creator	Shibamoto, Masanori
description	A joint board is arranged between an upper package and a lower package. The arrangement of the joint board makes it possible to reduce the size of solder balls and to arrange them with narrower pitch. The joint board has slightly greater dimensions those of the upper package and the lower package. This makes it possible to prevent underfill from leaking and spreading.
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language	eng
recordid	cdi_uspatents_grants_08203849
source	USPTO Issued Patents
title	Semiconductor device and manufacture method thereof
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