Laser beam formatting module and method for fabricating semiconductor dies using same

According to one exemplary embodiment, a laser beam formatting module for use in a lithographic system to fabricate a semiconductor wafer comprises an aperture plate having, for example, a circular aperture and capable of being situated between a laser source and a target, and a lens assembly, in a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LaFontaine, Bruno M, Wood, II, Obert Reeves
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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