Apparatus for increasing coverage of shielding gas during wire bonding

Apparatus for increasing coverage of shielding gas during wire bonding

A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located...

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Hauptverfasser: Song, Keng Yew James, Kwan, Ka Shing Kenny, Yeap, Boon June, Chen, Shi Jie, Balakrishnan, Sathish Kumar, Govindan Radhakrishnan, Kumaresh
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Sprache:eng
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creator Song, Keng Yew James
Kwan, Ka Shing Kenny
Yeap, Boon June
Chen, Shi Jie
Balakrishnan, Sathish Kumar
Govindan Radhakrishnan, Kumaresh
description A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet.
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title Apparatus for increasing coverage of shielding gas during wire bonding
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