Film forming additive formulations of conductive polymers
An aqueous dispersion including a partially fluorinated dispersant, an electrically conductive polymer and a film forming additive. The film forming additive includes a boiling temperature greater than about 85° C. (185° F.). In addition, the concentration of the film forming additive is less than t...
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| creator | Han-Adebekun, Gang Chris Markley, Thomas John Lowry, Michael Scott |
| description | An aqueous dispersion including a partially fluorinated dispersant, an electrically conductive polymer and a film forming additive. The film forming additive includes a boiling temperature greater than about 85° C. (185° F.). In addition, the concentration of the film forming additive is less than the solubility limit of the additive in water. The dynamic surface tension of the dispersion including the film forming additive is less than about 60 dynes/cm at 100 ms surface age. A method for making an electrically conductive polymer film and devices including electrically conductive polymer film are also disclosed. |
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The film forming additive includes a boiling temperature greater than about 85° C. (185° F.). In addition, the concentration of the film forming additive is less than the solubility limit of the additive in water. The dynamic surface tension of the dispersion including the film forming additive is less than about 60 dynes/cm at 100 ms surface age. A method for making an electrically conductive polymer film and devices including electrically conductive polymer film are also disclosed.</abstract><oa>free_for_read</oa></addata></record> |
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| title | Film forming additive formulations of conductive polymers |
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