Integrated semiconductor outline package

A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PC...

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Hauptverfasser: Job Doraisamy, Stanley, Yong, Wae Chet
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Sprache:eng
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creator Job Doraisamy, Stanley
Yong, Wae Chet
description A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.
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fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_08169069</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>08169069</sourcerecordid><originalsourceid>FETCH-uspatents_grants_081690693</originalsourceid><addsrcrecordid>eNrjZNDwzCtJTS9KLElNUShOzc1Mzs9LKU0uyS9SyC8tycnMS1UoSEzOTkxP5WFgTUvMKU7lhdLcDApuriHOHrqlxQVA3XklxfFAY0CUgYWhmaWBmaUxEUoA4scpvQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Integrated semiconductor outline package</title><source>USPTO Issued Patents</source><creator>Job Doraisamy, Stanley ; Yong, Wae Chet</creator><creatorcontrib>Job Doraisamy, Stanley ; Yong, Wae Chet ; Infineon Technologies AG</creatorcontrib><description>A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.</description><language>eng</language><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8169069$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8169069$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Job Doraisamy, Stanley</creatorcontrib><creatorcontrib>Yong, Wae Chet</creatorcontrib><creatorcontrib>Infineon Technologies AG</creatorcontrib><title>Integrated semiconductor outline package</title><description>A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZNDwzCtJTS9KLElNUShOzc1Mzs9LKU0uyS9SyC8tycnMS1UoSEzOTkxP5WFgTUvMKU7lhdLcDApuriHOHrqlxQVA3XklxfFAY0CUgYWhmaWBmaUxEUoA4scpvQ</recordid><startdate>20120501</startdate><enddate>20120501</enddate><creator>Job Doraisamy, Stanley</creator><creator>Yong, Wae Chet</creator><scope>EFH</scope></search><sort><creationdate>20120501</creationdate><title>Integrated semiconductor outline package</title><author>Job Doraisamy, Stanley ; Yong, Wae Chet</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_081690693</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Job Doraisamy, Stanley</creatorcontrib><creatorcontrib>Yong, Wae Chet</creatorcontrib><creatorcontrib>Infineon Technologies AG</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Job Doraisamy, Stanley</au><au>Yong, Wae Chet</au><aucorp>Infineon Technologies AG</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Integrated semiconductor outline package</title><date>2012-05-01</date><risdate>2012</risdate><abstract>A transistor outline package is provided for a semiconductor integrated device suitable for use in a control module of an automobile for connection between a printed circuit board and a bus bar of such a module. The package includes a package housing, having a first end suitable for mounting to a PCB and which has a width. The package is also formed with a leadframe which includes a heat sink and ground plane blade suitable for connection to a bus bar, a plurality of connector leads suitable for connection to a PCB and at least one source tab lead suitable for connection to a module connector of such a control module. The plurality of connection leads and the source tab lead extend from the first end of the package housing side by side in the direction along and within the width of the first end of the package housing.</abstract><oa>free_for_read</oa></addata></record>
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title Integrated semiconductor outline package
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T20%3A20%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Job%20Doraisamy,%20Stanley&rft.aucorp=Infineon%20Technologies%20AG&rft.date=2012-05-01&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E08169069%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true