Light emitting diode package and fabrication method thereof

Light emitting diode package and fabrication method thereof

An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Han, Kyung Taeg, Yeo, In Tae, Hahm, Hun Joo, Song, Chang Ho, Han, Seong Yeon, Na, Yoon Sung, Kim, Dae Yeon, Ahn, Ho Sik, Park, Young Sam
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Han, Kyung Taeg
Yeo, In Tae
Hahm, Hun Joo
Song, Chang Ho
Han, Seong Yeon
Na, Yoon Sung
Kim, Dae Yeon
Ahn, Ho Sik
Park, Young Sam
description An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_08168453</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>08168453</sourcerecordid><originalsourceid>FETCH-uspatents_grants_081684533</originalsourceid><addsrcrecordid>eNrjZLD2yUzPKFFIzc0sKcnMS1dIycxPSVUoSEzOTkxPVUjMS1FIS0wqykxOLMnMz1PITS3JyE9RKMlILUrNT-NhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwMLQzMLE1NiYCCUAbk0wQw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light emitting diode package and fabrication method thereof</title><source>USPTO Issued Patents</source><creator>Han, Kyung Taeg ; Yeo, In Tae ; Hahm, Hun Joo ; Song, Chang Ho ; Han, Seong Yeon ; Na, Yoon Sung ; Kim, Dae Yeon ; Ahn, Ho Sik ; Park, Young Sam</creator><creatorcontrib>Han, Kyung Taeg ; Yeo, In Tae ; Hahm, Hun Joo ; Song, Chang Ho ; Han, Seong Yeon ; Na, Yoon Sung ; Kim, Dae Yeon ; Ahn, Ho Sik ; Park, Young Sam ; Samsung LED Co., Ltd</creatorcontrib><description>An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.</description><language>eng</language><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8168453$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64038</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8168453$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Han, Kyung Taeg</creatorcontrib><creatorcontrib>Yeo, In Tae</creatorcontrib><creatorcontrib>Hahm, Hun Joo</creatorcontrib><creatorcontrib>Song, Chang Ho</creatorcontrib><creatorcontrib>Han, Seong Yeon</creatorcontrib><creatorcontrib>Na, Yoon Sung</creatorcontrib><creatorcontrib>Kim, Dae Yeon</creatorcontrib><creatorcontrib>Ahn, Ho Sik</creatorcontrib><creatorcontrib>Park, Young Sam</creatorcontrib><creatorcontrib>Samsung LED Co., Ltd</creatorcontrib><title>Light emitting diode package and fabrication method thereof</title><description>An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZLD2yUzPKFFIzc0sKcnMS1dIycxPSVUoSEzOTkxPVUjMS1FIS0wqykxOLMnMz1PITS3JyE9RKMlILUrNT-NhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwMLQzMLE1NiYCCUAbk0wQw</recordid><startdate>20120501</startdate><enddate>20120501</enddate><creator>Han, Kyung Taeg</creator><creator>Yeo, In Tae</creator><creator>Hahm, Hun Joo</creator><creator>Song, Chang Ho</creator><creator>Han, Seong Yeon</creator><creator>Na, Yoon Sung</creator><creator>Kim, Dae Yeon</creator><creator>Ahn, Ho Sik</creator><creator>Park, Young Sam</creator><scope>EFH</scope></search><sort><creationdate>20120501</creationdate><title>Light emitting diode package and fabrication method thereof</title><author>Han, Kyung Taeg ; Yeo, In Tae ; Hahm, Hun Joo ; Song, Chang Ho ; Han, Seong Yeon ; Na, Yoon Sung ; Kim, Dae Yeon ; Ahn, Ho Sik ; Park, Young Sam</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_081684533</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Han, Kyung Taeg</creatorcontrib><creatorcontrib>Yeo, In Tae</creatorcontrib><creatorcontrib>Hahm, Hun Joo</creatorcontrib><creatorcontrib>Song, Chang Ho</creatorcontrib><creatorcontrib>Han, Seong Yeon</creatorcontrib><creatorcontrib>Na, Yoon Sung</creatorcontrib><creatorcontrib>Kim, Dae Yeon</creatorcontrib><creatorcontrib>Ahn, Ho Sik</creatorcontrib><creatorcontrib>Park, Young Sam</creatorcontrib><creatorcontrib>Samsung LED Co., Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Han, Kyung Taeg</au><au>Yeo, In Tae</au><au>Hahm, Hun Joo</au><au>Song, Chang Ho</au><au>Han, Seong Yeon</au><au>Na, Yoon Sung</au><au>Kim, Dae Yeon</au><au>Ahn, Ho Sik</au><au>Park, Young Sam</au><aucorp>Samsung LED Co., Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light emitting diode package and fabrication method thereof</title><date>2012-05-01</date><risdate>2012</risdate><abstract>An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_08168453
source USPTO Issued Patents
title Light emitting diode package and fabrication method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T03%3A27%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Han,%20Kyung%20Taeg&rft.aucorp=Samsung%20LED%20Co.,%20Ltd&rft.date=2012-05-01&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E08168453%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true