Mobile communication terminal case and method of manufacturing the same

Mobile communication terminal case and method of manufacturing the same

There is provided a mobile communication terminal case including: a case body of a mobile communication terminal having a first surface and a second surface opposite to the first surface, and a via hole formed through the first surface and the second surface; a conductive pattern provided on the fir...

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Hauptverfasser: Lee, Byung Hwa, Yu, Yong Won, Mun, Hyun Sam, Kim, Young Suk
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Sprache:eng
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creator Lee, Byung Hwa
Yu, Yong Won
Mun, Hyun Sam
Kim, Young Suk
description There is provided a mobile communication terminal case including: a case body of a mobile communication terminal having a first surface and a second surface opposite to the first surface, and a via hole formed through the first surface and the second surface; a conductive pattern provided on the first surface of the case body; a carrier film provided on the first surface of the case body to cover the conductive pattern; and conductive epoxy filling the via hole and having one end thereof in contact with the conductive pattern.
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Kim, Young Suk</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_081656453</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Lee, Byung Hwa</creatorcontrib><creatorcontrib>Yu, Yong Won</creatorcontrib><creatorcontrib>Mun, Hyun Sam</creatorcontrib><creatorcontrib>Kim, Young Suk</creatorcontrib><creatorcontrib>Samsung Electro-Mechanics Co., Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Lee, Byung Hwa</au><au>Yu, Yong Won</au><au>Mun, Hyun Sam</au><au>Kim, Young Suk</au><aucorp>Samsung Electro-Mechanics Co., Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Mobile communication terminal case and method of manufacturing the same</title><date>2012-04-24</date><risdate>2012</risdate><abstract>There is provided a mobile communication terminal case including: a case body of a mobile communication terminal having a first surface and a second surface opposite to the first surface, and a via hole formed through the first surface and the second surface; a conductive pattern provided on the first surface of the case body; a carrier film provided on the first surface of the case body to cover the conductive pattern; and conductive epoxy filling the via hole and having one end thereof in contact with the conductive pattern.</abstract><oa>free_for_read</oa></addata></record>
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title Mobile communication terminal case and method of manufacturing the same
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