Interconnection method for tightly packed arrays with flex circuit
Exemplary embodiments provide interconnects and methods for interconnecting an electrical device array with a flexible circuit by filling a chemically-etched or laser-ablated integral stencil with conductive materials.
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | Exemplary embodiments provide interconnects and methods for interconnecting an electrical device array with a flexible circuit by filling a chemically-etched or laser-ablated integral stencil with conductive materials. |
|---|