Semiconductor packaging device

A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Shin, Dong-Woo, Han, Seong-Chan, Hwang, Sun-Kyu, Oh, Hyun-Jong, Oh, Nam-Yong
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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