Semiconductor packaging device
A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the...
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| creator | Shin, Dong-Woo Han, Seong-Chan Hwang, Sun-Kyu Oh, Hyun-Jong Oh, Nam-Yong |
| description | A semiconductor packaging device is provided. Semiconductor package groups, a side retainer wall, and a filling layer may be located on a base plate. The side retainer wall may be located around the semiconductor package groups. The filling layer may be located between the side retainer wall and the semiconductor package groups. |
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| language | eng |
| recordid | cdi_uspatents_grants_08148828 |
| source | USPTO Issued Patents |
| title | Semiconductor packaging device |
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