Device for thin die detachment and pick-up

Device for thin die detachment and pick-up

A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate a...

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Hauptverfasser: Chan, Man Wai, Au, Yuk Cheung, Wong, Kwok Wai, Chong, Chi Ming
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Sprache:eng
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creator Chan, Man Wai
Au, Yuk Cheung
Wong, Kwok Wai
Chong, Chi Ming
description A die detachment device for delaminating a die which is mounted at a position on an adhesive film comprises a plurality of movable plates having quadrilateral-shaped contact surfaces which are arranged adjacent to one another. The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.
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The plurality of movable plates comprises an intermediate movable plate and outer movable plates on opposite sides of the intermediate movable plate. The contact surfaces of the movable plates together form a combined contact surface for supporting the adhesive film at the position of the die, each movable plate being movable relative to the other movable plates towards and away from the die.</abstract><oa>free_for_read</oa></addata></record>
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title Device for thin die detachment and pick-up
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