Fuse and pad stress relief

A structure and method of forming the structure. At least one copper wire is formed within a first dielectric layer of a substrate. The top surface of each copper wire and of the first dielectric layer are essentially coplanar. A recess is formed in the first dielectric layer from the top surface of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Anderson, Felix Patrick, Gambino, Jeffrey Peter, McDevitt, Thomas Leddy, Stamper, Anthony Kendall
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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