Mechanical enhancer additives for low dielectric films

A chemical vapor deposition process for preparing a low dielectric constant organosilicate (OSG) having enhanced mechanical properties by adjusting the amount of organic groups, such as methyl groups, within the mixture is disclosed herein. In one embodiment of the present invention, the OSG film is...

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Bibliographische Detailangaben

Hauptverfasser:	Vincent, Jean Louise, O'Neill, Mark Leonard, Vrtis, Raymond Nicholas, Lukas, Aaron Scott, Peterson, Brian Keith, Bitner, Mark Daniel
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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