Electronic device package structures

A sealing layer is provided on a surface of a substrate, such as a semiconductor wafer. The sealing layer includes apertures which expose external contact locations for semiconductor dice formed on the wafer. Solder paste is deposited in the apertures and reflowed to form discrete conductive element...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Farnworth, Warren M
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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