Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof

A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a first plurality of leads disposed in a lead placement area around the die pad, a second plurality of leads disposed in corner regions of the lead placement area, a semiconductor chip on th...

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Hauptverfasser:	Chang Chien, Pao-Huei, Hu, Ping-Cheng, Chen, Chien-Wen
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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