Methods and apparatuses for electrochemical-mechanical polishing

Methods and apparatuses for removing material from a microfeature workpiece are disclosed. In one embodiment, the microfeature workpiece is contacted with a polishing surface of a polishing medium, and is placed in electrical communication with first and second electrodes, at least one of which is s...

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Bibliographische Detailangaben

1. Verfasser:	Lee, Whonchee
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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