Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method therefor

Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method therefor

A semiconductor device and a manufacturing method therefor wherein a wire for coupling an inner lead and a semiconductor chip with each other can be prevented from being electrically short-circuited to any other conductive part are provided. An inner lead portion has a tip arranged outside the outer...

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Hauptverfasser: Misumi, Kazuyuki, Fukudome, Katsuyuki, Hatauchi, Kazushi, Fukuhara, Kazuya, Yamashita, Kunihiro
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Sprache:eng
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creator Misumi, Kazuyuki
Fukudome, Katsuyuki
Hatauchi, Kazushi
Fukuhara, Kazuya
Yamashita, Kunihiro
description A semiconductor device and a manufacturing method therefor wherein a wire for coupling an inner lead and a semiconductor chip with each other can be prevented from being electrically short-circuited to any other conductive part are provided. An inner lead portion has a tip arranged outside the outer circumferential end of the semiconductor chip as viewed on a plane. A power supply bar has a jutted portion extended between the outer circumferential end of the semiconductor chip and the tip of the inner lead portion as viewed on a plane. The upper face of the jutted portion is in a position lower than the upper face of the tip of the inner lead portion. A bonding wire for electrically coupling the semiconductor chip and the inner lead portion with each other has a bent portion outside the outer circumferential end of the semiconductor chip as viewed on a plane.
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title Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method therefor
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