Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition
It is an objective of this invention to obtain: a composition superior in processability, dielectric properties, heat resistance, and adhesiveness by controlling phase separation of a 1,2-polybutadiene resin composition without deterioration of dielectric properties exhibited in high-frequency regio...
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| creator | Amou, Satoru Akahoshi, Haruo Shimizu, Hiroshi Hanawa, Akinori |
| description | It is an objective of this invention to obtain: a composition superior in processability, dielectric properties, heat resistance, and adhesiveness by controlling phase separation of a 1,2-polybutadiene resin composition without deterioration of dielectric properties exhibited in high-frequency regions; and a multilayer printed wiring board using the same.This invention relates to a polybutadiene resin composition, comprising: a crosslinking component (A) comprising repeating units represented by the following formula (1) and having a number average molecular weight of 1000 to 20000; a radical polymerization initiator (B), the one-minute half-life temperature of which is 80° C. to 140° C.; and a radical polymerization initiator (C), the one-minute half-life temperature of which is 170° C. to 230° C.; wherein 3 to 10 parts by weight of the component (B) and 5 to 15 parts by weight of the component (C) are contained relative to 100 parts by weight of the component (A). The invention also relates to a prepreg, a laminate, and a printed wiring board, which are produced using the same. |
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The invention also relates to a prepreg, a laminate, and a printed wiring board, which are produced using the same.</abstract><oa>free_for_read</oa></addata></record> |
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| title | Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition |
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