Methods of forming copper-comprising conductive lines in the fabrication of integrated circuitry

A method of forming copper-comprising conductive lines in the fabrication of integrated circuitry includes depositing damascene material over a substrate. Line trenches are formed into the damascene material. Copper-comprising material is electrochemically deposited over the damascene material. The...

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Bibliographische Detailangaben

1. Verfasser:	Bian, Zailong
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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