Reduced inductance IC leaded package

The present invention is directed a novel method and apparatus for reducing crosstalk in a lead frame based electrical device package. One cause of the crosstalk in the lead frame package is the mutual inductance between adjacent lead fingers. A conductive sheet or mesh is introduced into the lead f...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Long, Jon M
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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