Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same

A semiconductor chip package structure for achieving flip-chip electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit has a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wang, Bily, Yang, Hung-Chou, Chang, Jeng-Ru
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!