Stacked, interconnected semiconductor package

An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked semiconductor packages. A second such embodiment includes an external connector for electrically coupling the sta...

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Bibliographische Detailangaben

Hauptverfasser:	Yu, Cheeman, Liao, Chih-Chin, Takiar, Hem
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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