Integrated circuit package system with interposer

Integrated circuit package system with interposer

A method of manufacture of an integrated circuit package system includes: providing a base substrate; coupling a base integrated circuit on the base substrate; forming a double side molded interposer unit over the base integrated circuit including: providing an interposer substrate having an interpo...

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Hauptverfasser: Yang, Joungin, Jung, Dongjin, Yoon, In Sang
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Sprache:eng
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creator Yang, Joungin
Jung, Dongjin
Yoon, In Sang
description A method of manufacture of an integrated circuit package system includes: providing a base substrate; coupling a base integrated circuit on the base substrate; forming a double side molded interposer unit over the base integrated circuit including: providing an interposer substrate having an interposer top and an interposer bottom, mounting a first integrated circuit to the interposer bottom and electrically connected thereto, mounting a second integrated circuit to the interposer top and electrically connected thereto, and molding a first chip cover on the first integrated circuit and a second chip cover on the second integrated circuit; and coupling an external component to the double side molded interposer unit.
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coupling a base integrated circuit on the base substrate; forming a double side molded interposer unit over the base integrated circuit including: providing an interposer substrate having an interposer top and an interposer bottom, mounting a first integrated circuit to the interposer bottom and electrically connected thereto, mounting a second integrated circuit to the interposer top and electrically connected thereto, and molding a first chip cover on the first integrated circuit and a second chip cover on the second integrated circuit; and coupling an external component to the double side molded interposer unit.</abstract><oa>free_for_read</oa></addata></record>
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title Integrated circuit package system with interposer
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