Chip coated light emitting diode package and manufacturing method thereof

A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part el...

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Bibliographische Detailangaben

Hauptverfasser:	Lee, Seon Goo, Han, Kyung Taeg, Han, Seong Yeon
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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