Chip coated light emitting diode package and manufacturing method thereof

Chip coated light emitting diode package and manufacturing method thereof

A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part el...

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Hauptverfasser: Lee, Seon Goo, Han, Kyung Taeg, Han, Seong Yeon
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Sprache:eng
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creator Lee, Seon Goo
Han, Kyung Taeg
Han, Seong Yeon
description A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.
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fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_08013352</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>08013352</sourcerecordid><originalsourceid>FETCH-uspatents_grants_080133523</originalsourceid><addsrcrecordid>eNqNjDsKAjEQQNNYyOod5gLCahDslxXtt5chmSSDmw_J5P664AGsXvEeb6-eU-ACJqOQhZV9EKDIIpw8WM6WoKB5oyfAZCFi6g6N9Lr5SBKyBQlUKbuD2jlcGx1_HBTc52V6nHor33uS9vIVN4y38az19aL_SD6TgjV9</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Chip coated light emitting diode package and manufacturing method thereof</title><source>USPTO Issued Patents</source><creator>Lee, Seon Goo ; Han, Kyung Taeg ; Han, Seong Yeon</creator><creatorcontrib>Lee, Seon Goo ; Han, Kyung Taeg ; Han, Seong Yeon ; Samsung LED Co., Ltd</creatorcontrib><description>A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.</description><language>eng</language><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8013352$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/8013352$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Lee, Seon Goo</creatorcontrib><creatorcontrib>Han, Kyung Taeg</creatorcontrib><creatorcontrib>Han, Seong Yeon</creatorcontrib><creatorcontrib>Samsung LED Co., Ltd</creatorcontrib><title>Chip coated light emitting diode package and manufacturing method thereof</title><description>A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNjDsKAjEQQNNYyOod5gLCahDslxXtt5chmSSDmw_J5P664AGsXvEeb6-eU-ACJqOQhZV9EKDIIpw8WM6WoKB5oyfAZCFi6g6N9Lr5SBKyBQlUKbuD2jlcGx1_HBTc52V6nHor33uS9vIVN4y38az19aL_SD6TgjV9</recordid><startdate>20110906</startdate><enddate>20110906</enddate><creator>Lee, Seon Goo</creator><creator>Han, Kyung Taeg</creator><creator>Han, Seong Yeon</creator><scope>EFH</scope></search><sort><creationdate>20110906</creationdate><title>Chip coated light emitting diode package and manufacturing method thereof</title><author>Lee, Seon Goo ; Han, Kyung Taeg ; Han, Seong Yeon</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_080133523</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Lee, Seon Goo</creatorcontrib><creatorcontrib>Han, Kyung Taeg</creatorcontrib><creatorcontrib>Han, Seong Yeon</creatorcontrib><creatorcontrib>Samsung LED Co., Ltd</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Lee, Seon Goo</au><au>Han, Kyung Taeg</au><au>Han, Seong Yeon</au><aucorp>Samsung LED Co., Ltd</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip coated light emitting diode package and manufacturing method thereof</title><date>2011-09-06</date><risdate>2011</risdate><abstract>A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.</abstract><oa>free_for_read</oa></addata></record>
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title Chip coated light emitting diode package and manufacturing method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-23T18%3A09%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Lee,%20Seon%20Goo&rft.aucorp=Samsung%20LED%20Co.,%20Ltd&rft.date=2011-09-06&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E08013352%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true