Lead frame, electronic component including the lead frame, and manufacturing method thereof

A lead frame of the present invention includes: a die pad on which a device is mounted; a first connection terminal which is provided around the die pad, and the lower surface of which serves as an external terminal; a second connection terminal which is provided around the die pad and electrically...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Fukuda, Toshiyuki, Tomita, Yoshihiro, Umeda, Hisashi, Yaguchi, Yasutake
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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