Lead frame, electronic component including the lead frame, and manufacturing method thereof

Lead frame, electronic component including the lead frame, and manufacturing method thereof

A lead frame of the present invention includes: a die pad on which a device is mounted; a first connection terminal which is provided around the die pad, and the lower surface of which serves as an external terminal; a second connection terminal which is provided around the die pad and electrically...

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Hauptverfasser: Fukuda, Toshiyuki, Tomita, Yoshihiro, Umeda, Hisashi, Yaguchi, Yasutake
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Sprache:eng
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creator Fukuda, Toshiyuki
Tomita, Yoshihiro
Umeda, Hisashi
Yaguchi, Yasutake
description A lead frame of the present invention includes: a die pad on which a device is mounted; a first connection terminal which is provided around the die pad, and the lower surface of which serves as an external terminal; a second connection terminal which is provided around the die pad and electrically independent of the die pad, and the upper surface of which serves as an external terminal; a bent part provided between the first and the second connection terminals and connecting the first and the second connection terminals; and an outer frame. The bent part is bending-processed in a direction perpendicular to a face of the die pad. Within the outer frame, electronic component regions are formed adjoining each other and each including a die pad, and the first and the second connection terminals. The adjoining electronic components are connected through the first or the second connection terminal.
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The bent part is bending-processed in a direction perpendicular to a face of the die pad. Within the outer frame, electronic component regions are formed adjoining each other and each including a die pad, and the first and the second connection terminals. The adjoining electronic components are connected through the first or the second connection terminal.</abstract><oa>free_for_read</oa></addata></record>
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title Lead frame, electronic component including the lead frame, and manufacturing method thereof
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