Overlay measurement on double patterning substrate

1 2 A method of measuring overlay between a first structure and a second structure on a substrate is provided. The structures include equidistant elements, such as parallel lines, wherein the equidistant elements of the first and second structure alternate. A design width CDof the elements of the fi...

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Hauptverfasser: Van Der Heijden, Eddy Cornelis Antonius, Quaedackers, Johannes Anna, Oorschot, Dorothea Maria Christina, Meessen, Hieronymus Johannus Christiaan, Choi, Yin Fong
Format: Patent
Sprache:eng
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Zusammenfassung:1 2 A method of measuring overlay between a first structure and a second structure on a substrate is provided. The structures include equidistant elements, such as parallel lines, wherein the equidistant elements of the first and second structure alternate. A design width CDof the elements of the first structure is different from a design width CDof the elements of the second structure. The difference in design width can be used to identify measurement points having incorrectly measured overlay errors.