Resin molding part and manufacturing method thereof
A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first lead frame and the second lead frame from the primary molding resin portion, a hook-and-hold portion for...
Gespeichert in:
Hauptverfasser: | , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Nakata, Mitsuaki Abe, Tomonori Tsuji, Kosei Awano, Yuhei Yamashita, Kazuhiko Iinuma, Hideo Katsuno, Iwao Inuzuka, Takayuki Fujita, Akihiro |
description | A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first lead frame and the second lead frame from the primary molding resin portion, a hook-and-hold portion for preventing separation of the first lead frame from the primary molding resin portion and separation of the second lead frame from the primary molding resin portion is provided on an outer surface of each of the first lead frame and the second lead frame. Thus, a resin molding part capable of achieving suppression of increase in a thickness thereof without deformation or displacement of a lead frame and a manufacturing method thereof can be provided. |
format | Patent |
fullrecord | <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_07986031</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>07986031</sourcerecordid><originalsourceid>FETCH-uspatents_grants_079860313</originalsourceid><addsrcrecordid>eNrjZDAOSi3OzFPIzc9JycxLVyhILCpRSMxLUchNzCtNS0wuKS0CCeemlmTkpyiUZKQWpean8TCwpiXmFKfyQmluBgU31xBnD93S4oLEktS8kuL49KJEEGVgbmlhZmBsaEyEEgDfpS2D</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Resin molding part and manufacturing method thereof</title><source>USPTO Issued Patents</source><creator>Nakata, Mitsuaki ; Abe, Tomonori ; Tsuji, Kosei ; Awano, Yuhei ; Yamashita, Kazuhiko ; Iinuma, Hideo ; Katsuno, Iwao ; Inuzuka, Takayuki ; Fujita, Akihiro</creator><creatorcontrib>Nakata, Mitsuaki ; Abe, Tomonori ; Tsuji, Kosei ; Awano, Yuhei ; Yamashita, Kazuhiko ; Iinuma, Hideo ; Katsuno, Iwao ; Inuzuka, Takayuki ; Fujita, Akihiro ; Mitsubishi Electric Corporation</creatorcontrib><description>A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first lead frame and the second lead frame from the primary molding resin portion, a hook-and-hold portion for preventing separation of the first lead frame from the primary molding resin portion and separation of the second lead frame from the primary molding resin portion is provided on an outer surface of each of the first lead frame and the second lead frame. Thus, a resin molding part capable of achieving suppression of increase in a thickness thereof without deformation or displacement of a lead frame and a manufacturing method thereof can be provided.</description><language>eng</language><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7986031$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/7986031$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Nakata, Mitsuaki</creatorcontrib><creatorcontrib>Abe, Tomonori</creatorcontrib><creatorcontrib>Tsuji, Kosei</creatorcontrib><creatorcontrib>Awano, Yuhei</creatorcontrib><creatorcontrib>Yamashita, Kazuhiko</creatorcontrib><creatorcontrib>Iinuma, Hideo</creatorcontrib><creatorcontrib>Katsuno, Iwao</creatorcontrib><creatorcontrib>Inuzuka, Takayuki</creatorcontrib><creatorcontrib>Fujita, Akihiro</creatorcontrib><creatorcontrib>Mitsubishi Electric Corporation</creatorcontrib><title>Resin molding part and manufacturing method thereof</title><description>A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first lead frame and the second lead frame from the primary molding resin portion, a hook-and-hold portion for preventing separation of the first lead frame from the primary molding resin portion and separation of the second lead frame from the primary molding resin portion is provided on an outer surface of each of the first lead frame and the second lead frame. Thus, a resin molding part capable of achieving suppression of increase in a thickness thereof without deformation or displacement of a lead frame and a manufacturing method thereof can be provided.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZDAOSi3OzFPIzc9JycxLVyhILCpRSMxLUchNzCtNS0wuKS0CCeemlmTkpyiUZKQWpean8TCwpiXmFKfyQmluBgU31xBnD93S4oLEktS8kuL49KJEEGVgbmlhZmBsaEyEEgDfpS2D</recordid><startdate>20110726</startdate><enddate>20110726</enddate><creator>Nakata, Mitsuaki</creator><creator>Abe, Tomonori</creator><creator>Tsuji, Kosei</creator><creator>Awano, Yuhei</creator><creator>Yamashita, Kazuhiko</creator><creator>Iinuma, Hideo</creator><creator>Katsuno, Iwao</creator><creator>Inuzuka, Takayuki</creator><creator>Fujita, Akihiro</creator><scope>EFH</scope></search><sort><creationdate>20110726</creationdate><title>Resin molding part and manufacturing method thereof</title><author>Nakata, Mitsuaki ; Abe, Tomonori ; Tsuji, Kosei ; Awano, Yuhei ; Yamashita, Kazuhiko ; Iinuma, Hideo ; Katsuno, Iwao ; Inuzuka, Takayuki ; Fujita, Akihiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_079860313</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Nakata, Mitsuaki</creatorcontrib><creatorcontrib>Abe, Tomonori</creatorcontrib><creatorcontrib>Tsuji, Kosei</creatorcontrib><creatorcontrib>Awano, Yuhei</creatorcontrib><creatorcontrib>Yamashita, Kazuhiko</creatorcontrib><creatorcontrib>Iinuma, Hideo</creatorcontrib><creatorcontrib>Katsuno, Iwao</creatorcontrib><creatorcontrib>Inuzuka, Takayuki</creatorcontrib><creatorcontrib>Fujita, Akihiro</creatorcontrib><creatorcontrib>Mitsubishi Electric Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Nakata, Mitsuaki</au><au>Abe, Tomonori</au><au>Tsuji, Kosei</au><au>Awano, Yuhei</au><au>Yamashita, Kazuhiko</au><au>Iinuma, Hideo</au><au>Katsuno, Iwao</au><au>Inuzuka, Takayuki</au><au>Fujita, Akihiro</au><aucorp>Mitsubishi Electric Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Resin molding part and manufacturing method thereof</title><date>2011-07-26</date><risdate>2011</risdate><abstract>A primary molding product is formed by integrally forming a first lead frame and a second lead frame with a primary molding resin portion. In addition, in order to prevent separation of the first lead frame and the second lead frame from the primary molding resin portion, a hook-and-hold portion for preventing separation of the first lead frame from the primary molding resin portion and separation of the second lead frame from the primary molding resin portion is provided on an outer surface of each of the first lead frame and the second lead frame. Thus, a resin molding part capable of achieving suppression of increase in a thickness thereof without deformation or displacement of a lead frame and a manufacturing method thereof can be provided.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_uspatents_grants_07986031 |
source | USPTO Issued Patents |
title | Resin molding part and manufacturing method thereof |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T15%3A22%3A00IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Nakata,%20Mitsuaki&rft.aucorp=Mitsubishi%20Electric%20Corporation&rft.date=2011-07-26&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E07986031%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |