Notch stop pulsing process for plasma processing system

A method for etching a substrate having a silicon layer in a plasma processing chamber having a bottom electrode on which the substrate is disposed on during etching. The method includes performing a main etch step. The method also includes terminating main etch step when a predefined etch depth of...

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Hauptverfasser: Pandhumsoporn, Tamarak, Cofer, Alferd
Format: Patent
Sprache:eng
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