Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

A relay board provided in a semiconductor device, including an entire main surface that is made of a conductive material. The relay board may further include a substrate made of the same material as at least one semiconductor element provided in the semiconductor device. The main surface of the rela...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Nishimura, Takao, Narisawa, Yoshiaki, Kumagaya, Yoshikazu
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!