Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device
A relay board provided in a semiconductor device, including an entire main surface that is made of a conductive material. The relay board may further include a substrate made of the same material as at least one semiconductor element provided in the semiconductor device. The main surface of the rela...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A relay board provided in a semiconductor device, including an entire main surface that is made of a conductive material. The relay board may further include a substrate made of the same material as at least one semiconductor element provided in the semiconductor device. The main surface of the relay board may be formed at an upper part of the substrate. |
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